Intuitive thermal user interface

ABSTRACT

An electronic device that provides thermal feedback to a user is described. In particular, when the user provides a setting via tactile interaction with a surface of a user-interface device in the electronic device, a thermal mechanism in the electronic device establishes a temperature gradient on the surface based on the setting. For example, the thermal mechanism may include a heat source that increases a temperature of the portion of the user-interface device and/or a heat sink that decreases a temperature of another portion of the user-interface device. Moreover, the thermal mechanism may dynamically modify the temperature gradient based on the tactile interaction and an environmental condition (such as the temperature) in an external environment that includes the electronic device. Note that the tactile interaction with the user may occur with a physical control object (such as a knob) and/or with a virtual icon displayed on a multi-touch display.

CROSS REFERENCE TO RELATED APPLICATION

This application claims priority under 35 U.S.C. §120 as a ContinuationPatent Application to U.S. patent application Ser. No. 14/470,774,entitled “Intuitive Thermal User Interface,” by Nina S. Joshi, Bjorn H.Hovland, Aaron H. Squier, and Andrew G. Stevens, filed on Aug. 27, 2014,the contents of which are herein incorporated by reference.

BACKGROUND

1. Field

The described embodiments relate generally to a user interface for usewith an electronic device. More specifically, the described embodimentsrelate to a user interface that provides thermal feedback to a user.

2. Related Art

Trends in connectivity and in portable electronic devices are resultingin dramatic changes in people's lives. For example, the Internet nowallows individuals access to vast amounts of information, as well as theability to identify and interact with individuals, organizations andcompanies around the world. This has resulted in a significant increasein online financial transactions (which are sometimes referred to as‘ecommerce’). Similarly, the increasingly powerful computing andcommunication capabilities of portable electronic device (such assmartphones and tablets), as well as a large and growing set ofapplications, are accelerating these changes, providing individualsaccess to information at arbitrary locations and the ability to leveragethis information to perform a wide variety of tasks.

Recently, it has been proposed these capabilities be included in otherelectronic devices that are located throughout our environments,including those that people interact with infrequently. In the so-called‘Internet of things,’ it has been proposed that future versions of theseso-called ‘background’ electronic devices be outfitted with morepowerful computing capabilities and networking subsystems to facilitatewired or wireless communication. For example, the background electronicdevices may include: a cellular network interface (LTE, etc.), awireless local area network interface (e.g., a wireless network such asdescribed in the Institute of Electrical and Electronics Engineers(IEEE) 802.11 standard or Bluetooth™ from the Bluetooth Special InterestGroup of Kirkland, Wash.), and/or another type of wireless interface(such as a near-field-communication interface). These capabilities mayallow the background electronic devices to be integrated intoinformation networks, thereby further transforming people's lives.

However, the overwhelming majority of the existing background electronicdevices in people's homes, offices and vehicles have neither enhancedcomputing capabilities (such as processor that can execute a widevariety of applications) nor networking subsystems. Given the economicsof many market segments (such as the consumer market segment), theseso-called ‘legacy’ background electronic devices (which are sometimesreferred to as ‘legacy electronic devices’) are unlikely to be rapidlyreplaced.

These barriers to entry and change are obstacles to widely implementingthe Internet of things. For example, in the absence of enhancedcomputing capabilities and/or networking subsystems it may be difficultto communicate with the legacy electronic devices. Furthermore, evenwhen electronic devices include enhanced computing capabilities and/ornetworking subsystems, power consumption and battery life may limit theapplications and tasks that can be performed. In addition, it is oftendifficult to use the legacy electronic devices.

SUMMARY

The described embodiments relate to an electronic device that includes auser-interface device having a surface that receives a setting based ontactile interaction with a user of the electronic device. Moreover, theelectronic device includes a thermal mechanism, thermally coupled to aportion of the user-interface device, which establishes a temperaturegradient on the surface based on the setting.

For example, the thermal mechanism may include a heat source thatincreases a temperature of the portion of the user-interface device.Alternatively or additionally, the thermal mechanism may include a heatsink that decreases a temperature of another portion of theuser-interface device, which is different that the portion of theuser-interface device.

Furthermore, the thermal mechanism may dynamically modify thetemperature gradient based on the tactile interaction with the user andan environmental condition in an external environment that includes theelectronic device. For example, the tactile interaction may includechanging the setting of the electronic device using the user-interfacedevice.

Note that the user-interface device may include: a touch pad, amulti-touch display (i.e., a display that the user interacts with usingone or more digits), and/or a knob. Thus, the tactile interaction withthe user may occur with a physical control object (such as the knob)and/or with a virtual icon displayed on the multi-touch display.

Additionally, the electronic device may include a thermostat.

In some embodiments, a thermal impedance of the user-interface devicevaries over the user-interface device to increase user perception of thetemperature gradient. For example, the variation in the thermalimpedance may be associated with different thicknesses of a material inat least one layer in the user-interface device. Alternatively oradditionally, a cross-sectional area of the portion of theuser-interface device varies as the user changes the setting using theuser-interface device.

Moreover, a texture may vary over the surface of the user-interfacedevice to increase user perception of the temperature gradient.

Furthermore, at a given time, the thermal mechanism may provide a staticthermal flux. Alternatively, at a given time, the thermal mechanism mayestablish the temperature gradient by duty-cycle averaging thermalpulses.

In some embodiments, the user-interface device provides additionalsensory feedback to the user. For example, the user-interface device mayrotate about an axis, and a rotational resistance of the user-interfacedevice may vary as the user rotates the user-interface device betweenend rotation positions associated with extrema of settings defined usingthe user-interface device. The rotational resistance may varycontinuously as the user-interface device is rotated between the endrotation positions. Alternatively or additionally, the rotationalresistance may vary when the user-interface device is rotated inproximity to the end rotation positions. Note that the rotationresistance may be associated with: an electromagnet, a ferro-magnet, aphase change of a material, a magnetorheological fluid, and/or amechanical stop.

Another embodiment provides an electronic device that includes theuser-interface device and the thermal mechanism described above. Inaddition, the electronic device may include a control mechanism thatmodifies a function of the electronic device based on the receivedsetting.

Another embodiment provides a method for interacting with the user,which may be performed by an embodiment of the electronic device. Duringoperation, the electronic device receives the setting based on thetactile interaction between the user and the surface of theuser-interface device in the electronic device. Then, the thermalmechanism in the electronic device establishes the temperature gradienton the surface based on the setting.

The preceding summary is provided as an overview of some exemplaryembodiments and to provide a basic understanding of aspects of thesubject matter described herein. Accordingly, the above-describedfeatures are merely examples and should not be construed as narrowingthe scope or spirit of the subject matter described herein in any way.Other features, aspects, and advantages of the subject matter describedherein will become apparent from the following Detailed Description,Figures, and Claims.

BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a block diagram illustrating a front view of a user interfacein an electronic device in accordance with an embodiment of the presentdisclosure.

FIG. 2 is a block diagram illustrating a side view of the user interfacein the electronic device of FIG. 1 in accordance with an embodiment ofthe present disclosure.

FIG. 3 is a block diagram illustrating a side view of the user interfacein the electronic device of FIG. 1 in accordance with an embodiment ofthe present disclosure.

FIG. 4 is a block diagram illustrating a side view of the user interfacein the electronic device of FIG. 1 in accordance with an embodiment ofthe present disclosure.

FIG. 5 is a block diagram illustrating a front view of user interface inthe electronic device of FIG. 1 in accordance with an embodiment of thepresent disclosure.

FIG. 6 is a block diagram illustrating the electronic device of FIG. 1in accordance with an embodiment of the present disclosure.

FIG. 7 is a flow diagram illustrating a method for interacting with auser in accordance with an embodiment of the present disclosure.

FIG. 8 is a drawing illustrating communication within the electronicdevice of FIGS. 1 and 6 during the method of FIG. 7 in accordance withan embodiment of the present disclosure.

Note that like reference numerals refer to corresponding partsthroughout the drawings. Moreover, multiple instances of the same partare designated by a common prefix separated from an instance number by adash.

DETAILED DESCRIPTION

An electronic device that provides thermal feedback to a user isdescribed. In particular, when the user provides a setting via tactileinteraction with a surface of a user-interface device in the electronicdevice, a thermal mechanism in the electronic device establishes atemperature gradient on the surface based on the setting. For example,the thermal mechanism may include a heat source that increases atemperature of the portion of the user-interface device and/or a heatsink that decreases a temperature of another portion of theuser-interface device. Moreover, the thermal mechanism may dynamicallymodify the temperature gradient based on the tactile interaction and anenvironmental condition (such as the temperature) in an externalenvironment that includes the electronic device. Note that the tactileinteraction with the user may occur with a physical control object (suchas a knob) and/or with a virtual icon displayed on a multi-touchdisplay.

In this way, the electronic device may intuitively provide thermalfeedback to the user. For example, the user-interface device may beassociated with a thermostat, and the thermal feedback may intuitivelyalert the user to the consequences of changes to a temperature settingrelative to the current temperature in a room. Thus, when thetemperature setting exceeds the current temperature, the temperature ofthe surface may be increased, and when the temperature setting is lessthan the current temperature, the temperature of the surface may bedecreased. This intuitive feedback may make the electronic device easierand/or more enjoyable to user. The resulting improved functionalityoffered by the electronic device may promote sales of the electronicdevice (and, more generally, commercial activity) and may enhancecustomer satisfaction with the electronic device.

Note that this user-interface technique is not an abstract idea. Inparticular, the intuitive thermal feedback (and, more generally, theintuitive sensory feedback) in the embodiments of the user-interfacetechnique is not: a fundamental economic principle, a human activity,and/or a mathematical relationship/formula. Moreover, the user-interfacetechnique amounts to significantly more than an alleged abstract idea.In particular, the user-interface technique may improve the functioningof the electronic device that executes software and/or implements theuser-interface technique. For example, the user-interface technique may:improve the user-friendliness of a user interface that includes theuser-interface device; and/or improve other performance metrics relatedto the function of the electronic device. Furthermore, the thermalgradient established by the thermal mechanism in the electronic deviceconstitutes a technical effect in which information is transformed.

We now describe embodiments of a user interface in the electronicdevice. FIG. 1 presents a block diagram illustrating a front view of auser interface 108 in an embodiment of electronic device 100. Thiselectronic device includes a user-interface device 110 having a surface112 that receives a setting based on tactile interaction with a user ofelectronic device 100. For example, user-interface device 110 mayinclude a rotatable knob, and the user may change the setting bygrasping the knob with two or more fingers or digits on a hand 114 androtating the knob clockwise or counterclockwise. While a knob is used asan illustration in FIG. 1, in other embodiments user interface 108includes a wide variety of user-interface devices, including: a touchpad, a multi-touch display (i.e., a display that the user interacts withusing one or more digits), a keyboard, a mouse, a stylus, etc. Thus, thetactile interaction with the user may occur with a physical controlobject (such as the knob) and/or with a virtual icon (such as a virtualicon displayed on the multi-touch display).

FIG. 2 presents a block diagram illustrating a side view of the userinterface in an embodiment of electronic device 100. In particular,electronic device may include a thermal mechanism 210, thermally coupledto a portion of user-interface device 110, which establishes atemperature gradient 212 on surface 210 based on setting 208 receivedfrom user-interface device 110 via a user-interface controller 206(which converts electrical signals 204 into setting 208 on outputssetting 208 on a signal line), so that there is a hot side and cold sideof user-interface device 110. (In FIG. 2, user-interface device 110 isillustrated as a touchpad or a multi-touch screen. However, as notedpreviously, a wide variety of user-interface devices may be used in thisand the other described embodiments.) For example, thermal mechanism 210may include a heat source 214 thermally coupled to user-interface device110 by heat path 220-1, which increases a temperature of the portion ofuser-interface device 110. Alternatively or additionally, thermalmechanism 210 may include an optional heat sink 216 thermally coupled touser-interface device 110 by heat path 220-2, which decreases atemperature of another portion of user-interface device 110, which isdifferent that the portion of user-interface device 110. Note thatuser-interface device 110 may have a thermal time constant that allowstemperature gradient 112 to be established while the user interacts withuser-interface device 110 to change setting 208, and a thermal impedance(or thermal resistance) that allows the user to perceive temperaturegradient 212 while the user interacts with user-interface device 110 tochange the setting 208.

As an example, heat source 214 may include a resistor (whose temperaturecan be changed by changing a magnitude of a DC or the magnitude orfrequency of an AC current), and optional heat sink 216 may includePeltier cooler (and, more generally, a thermoelectric or a solid-statecooler) or a fan (and, more generally, a forced-fluid driver) that coolsthe other portion. In another example, a heat pump (such as asolid-state thermal element based on the Peltier effect or heat pipethat includes counterflows of different phases of a material)establishes temperature gradient 212. More generally, heat source 214may be a direct or indirect heat source, and/or optional heat sink 216may be a direct or indirect heat sink. In addition, heat source 214and/or optional heat sink 216 may be active or passive components.

At a given time, thermal mechanism 210 may provide a static thermalflux. Alternatively, at a given time, thermal mechanism 210 mayestablish temperature gradient 212 by duty-cycle averaging thermalpulses. More generally, thermal mechanism 210 may establish temperaturegradient 212 using a variety of modulation techniques, including:amplitude modulation, frequency modulation, phase modulation, pulse-codemodulation, a sigma-delta modulator, etc.

In an exemplary embodiment, thermal mechanism 210 dynamically modifiestemperature gradient 212 based on the tactile interaction with the user(and, in particular, the user changing setting 208 using user-interfacedevice 110) and an environmental condition in an external environment(such as a room or a portion of a building) that includes electronicdevice 100. For example, electronic device 100 may include a thermostat.As the user adjusts or changes a temperature setting relative to acurrent temperature in the external environment, thermal mechanism 210may increase or decrease temperature gradient 212 to give the userreal-time (relative to the rate at which the user changes or adjusts thetemperature setting) thermal feedback. Thus, as the temperature settingexceeds and then progressively increases relative to the currenttemperature, thermal mechanism 210 may increase temperature gradient 212so that the temperature of the portion of surface 112 the user istouching increases. Similarly, as the temperature setting drops belowand then progressively decreases relative to the current temperature,thermal mechanism 210 may decrease temperature gradient 212 so that thetemperature of the portion of surface 112 the user is touchingdecreases. These changes in temperature gradient 212 may allow the userto intuitively understand the consequences of the changes in thetemperature setting. However, while the preceding example used atemperature setting of a thermostat as an illustration, theuser-interface technique may be used with a wide variety or types ofsettings, such as: humidity, air-quality settings, lighting settings,etc.

In some embodiments, electronic device 100 includes an optional controlmechanism 218 that modifies a function of electronic device 100 based onreceived setting 208. In the case of the thermostat example, optionalcontrol mechanism 218 may change a feedback signal to a heating element(such as a furnace) and/or a cooling element (such as an air conditioneror a fan) in response to setting 208. This change in the feedback signalmay provide closed-loop control of an environmental condition (such asthe temperature) in the external environment that includes electronicdevice 100.

The user-interface device may include one or more features that enhance(or reduce) the temperature gradient. This is illustrated in FIG. 3,which presents a block diagram illustrating a side view of the userinterface in an embodiment of electronic device 100. In particular, athermal impedance of user-interface device 110 may vary overuser-interface device 110 (such as over surface 112) to increase userperception of temperature gradient 212. For example, the variation inthe thermal impedance may be associated with different thicknesses 310of a material in at least one layer 312 in user-interface device 110.Alternatively or additionally, a cross-sectional area of the portion ofuser-interface device 110 may vary as the user changes setting 208 usinguser-interface device 110. For example, as shown in the inset box inFIG. 3, in the case of knob 314, two triangular-shaped pieces of metal316 may be rotated past each other as knob 314 is turned, therebychanging the cross-sectional area(s) (such as cross-sectional area 318)in one or more thermal paths between heat source 214 and the portion ofuser-interface device 110 on surface 112, and/or between optional heatsink 216 and the other portion of user-interface device 110 on surface112. In some embodiments, the thermal impedance is dynamically changedby dynamically inducing a phase change in a material in user-interfacedevice 110 (such as an organic phase-change material, an inorganicphase-change material, a eutectic phase-change material, etc.), therebydynamically varying the thermal conductivity of the material. Forexample, the thermal conductivity of nanofibers of polyethylene can bedynamically varied by applying temperature and/or stress.

Alternatively or additionally, the user-interface device may include oneor more features that enhance (or reduce) the user's perception of thetemperature gradient. This is shown in FIG. 4, which presents a blockdiagram illustrating a side view of the user interface in an embodimentof electronic device 100. In particular, textures 410 may vary oversurface 112 of the user-interface device 110 to increase (or decrease)user perception of temperature gradient 212. Thus, there may be a coarsetexture towards one end of surface 112 and a fine texture towards theother end.

In some embodiments, in addition to the thermal feedback, theuser-interface device provides additional sensory feedback to the user.This is shown in FIG. 5, which presents a block diagram illustrating afront view of user interface 108 in an embodiment of electronic device100. In particular, user-interface device 110 may rotate about an axis(e.g., user-interface device 110 may include a physical or a virtualknob, such as knob 510, which is rotated relative to a stationary piece508), and a rotational resistance of user-interface device 110 may varyas the user rotates user-interface device 110 between end rotationpositions 512 associated with extrema of settings defined usinguser-interface device 110. The rotational resistance may varycontinuously as user-interface device 110 is rotated between endrotation positions 512. Alternatively or additionally, the rotationalresistance may vary when user-interface device 110 is rotated inproximity regions 514 to end rotation positions 512 (such as within 5°of end rotation positions 512). As shown in FIG. 5, the rotationresistance is varied using electromagnet 516 and a ferro-magnet 518, sothat the rotation resistance increases in a counterclockwise directionand decreases in a clockwise direction. However, a variety of techniquesmay be used to change the rotation resistance, including: anelectromagnet, a ferro-magnet, a phase change of a material, amagnetorheological fluid, and/or a mechanical stop.

Although we describe the environments shown in FIGS. 1-5 as examples, inalternative embodiments different numbers or types of components may bepresent. For example, some embodiments comprise more or fewercomponents, components may be at different positions and/or two or morecomponents may be combined into a single component.

FIG. 6 presents a block diagram illustrating an embodiment of electronicdevice 100. This electronic device includes processing subsystem 610(and, more generally, an integrated circuit or a control mechanism),memory subsystem 612, a networking subsystem 614, power subsystem 616,switching subsystem 620, optional sensor subsystem 624 (i.e., adata-collection subsystem and, more generally, a sensor mechanism),and/or user-interface subsystem 638. Processing subsystem 610 includesone or more devices configured to perform computational operations andto execute techniques to process sensor data. For example, processingsubsystem 610 can include one or more microprocessors,application-specific integrated circuits (ASICs), microcontrollers,programmable-logic devices, and/or one or more digital signal processors(DSPs).

Memory subsystem 612 includes one or more devices for storing dataand/or instructions for processing subsystem 610, networking subsystem614, optional sensor subsystem 624 and/or user-interface subsystem 638.For example, memory subsystem 612 can include dynamic random accessmemory (DRAM), static random access memory (SRAM), and/or other types ofmemory. In some embodiments, instructions for processing subsystem 610in memory subsystem 612 include: one or more program modules 632 or setsof instructions, which may be executed in an operating environment (suchas operating system 634) by processing subsystem 610. Note that the oneor more computer programs may constitute a computer-program mechanism ora program module. Moreover, instructions in the various modules inmemory subsystem 612 may be implemented in: a high-level procedurallanguage, an object-oriented programming language, and/or in an assemblyor machine language. Furthermore, the programming language may becompiled or interpreted, e.g., configurable or configured (which may beused interchangeably in this discussion), to be executed by processingsubsystem 610.

In addition, memory subsystem 612 can include mechanisms for controllingaccess to the memory. In some embodiments, memory subsystem 612 includesa memory hierarchy that comprises one or more caches coupled to a memoryin electronic device 100. In some of these embodiments, one or more ofthe caches is located in processing subsystem 610.

In some embodiments, memory subsystem 612 is coupled to one or morehigh-capacity mass-storage devices (not shown). For example, memorysubsystem 612 can be coupled to a magnetic or optical drive, asolid-state drive, or another type of mass-storage device. In theseembodiments, memory subsystem 612 can be used by electronic device 100as fast-access storage for often-used data, while the mass-storagedevice is used to store less frequently used data.

Networking subsystem 614 includes one or more devices configured tocouple to and communicate on a wired, optical and/or wireless network(i.e., to perform network operations and, more generally,communication), including an interface circuit 628 (such as a ZigBee®communication circuit) and one or more antennas 630. For example,networking subsystem 614 may include: a ZigBee® networking subsystem, aBluetooth™ networking system (which can include Bluetooth™ Low Energy,BLE or Bluetooth™ LE), a cellular networking system (e.g., a 3G/4Gnetwork such as UMTS, LTE, etc.), a USB networking system, a networkingsystem based on the standards described in IEEE 802.11 (e.g., a Wi-Fi®networking system), an Ethernet networking system, an infra-redcommunication system, a power-line communication system and/or anothercommunication system (such as a near-field-communication system or anad-hoc-network networking system).

Moreover, networking subsystem 614 includes processors, controllers,radios/antennas, sockets/plugs, and/or other devices used for couplingto, communicating on, and handling data and events for each supportednetworking or communication system. Note that mechanisms used forcoupling to, communicating on, and handling data and events on thenetwork for each network system are sometimes collectively referred toas a ‘network interface’ for the network system. Moreover, in someembodiments a ‘network’ between the electronic devices does not yetexist. Therefore, electronic device 100 may use the mechanisms innetworking subsystem 614 for performing simple wireless communicationbetween electronic device 100 and other electronic devices, e.g.,transmitting advertising frames, petitions, beacons and/or informationassociated with near-field communication.

Moreover, electronic device 100 may include power subsystem 616 with oneor more power sources 618. Each of these power sources may include: abattery (such as a rechargeable or a non-rechargeable battery), a DCpower supply, an AC power supply, a switched-mode power supply, aregulated power supply and/or a transformer. In some embodiments, powersubsystem 616 includes a recharging circuit that recharges arechargeable battery in at least one of power sources 618. This mayfacilitate the recharging by converting an electrical signal in powersubsystem 616 into a DC or an AC electrical signal that is suitable forrecharging the rechargeable battery. Furthermore, the one or more powersources 618 may operate in a voltage-limited mode or a current-limitedmode. Furthermore, these power sources may be mechanically andelectrically coupled by a male or female adaptor to: a wall orelectrical-outlet socket or plug (such as a two or three-prongedelectrical-outlet plug, which may be collapsible or retractable), alight socket (or light-bulb socket), electrical wiring (such as amulti-wire electrical terminal), a generator, a USB port or connector, aDC-power plug or socket, a cellular-telephone charger cable, aphotodiode, a photovoltaic cell, etc. This mechanical and electricalcoupling may be rigid or may be remateable. Note that the one or morepower sources 618 may be mechanically and electrically coupled to anexternal power source or another electronic device by one of theelectrical-connection nodes in switch 622 in switching subsystem 620.

In some embodiments, power subsystem 616 includes or functions as apass-through power supply for one or more electrical connectors to anexternal electronic device (such as an appliance or a regulator device)that can be plugged into the one or more electrical connectors. Power tothe one or more electrical connectors (and, thus, the externalelectronic device) may be controlled locally by processing subsystem610, switching subsystem 620 (such as by switch 622), and/or remotelyvia networking subsystem 614.

Furthermore, optional sensor subsystem 624 may include one or moresensor devices 626 (or a sensor array), which may include one or moreprocessors and memory. For example, the one or more sensor devices 626may include: a thermal sensor (such as a thermometer), a humiditysensor, a barometer, a camera or video recorder (such as a CCD or CMOSimaging sensor), one or more microphones (which may be able to recordacoustic information, including acoustic information in an audio band offrequencies, in mono or stereo), a load-monitoring sensor or anelectrical-characteristic detector (and, more generally, a sensor thatmonitors one or more electrical characteristics), an infrared sensor(which may be active or passive), a microscope, a particle detector(such as a detector of dander, pollen, dust, exhaust, etc.), anair-quality sensor, a particle sensor, an optical particle sensor, anionization particle sensor, a smoke detector (such as an optical smokedetector or an ionizing smoke detector), a fire-detection sensor, aradon detector, a carbon-monoxide detector, a chemical sensor ordetector, a volatile-organic-compound sensor, a combustible gas sensor,a chemical-analysis device, a mass spectrometer, a microanalysis device,a nano-plasmonic sensor, a genetic sensor (such as a micro-array), anaccelerometer, a position or a location sensor (such as a locationsensor based on the Global Positioning System or GPS), a gyroscope, amotion sensor (such as a light-beam sensor), a contact sensor, a strainsensor (such as a strain gauge), a proximity sensor, a microwave/radarsensor (which may be active or passive), an ultrasound sensor, avibration sensor, a fluid flow sensor, a photo-detector, a Geigercounter, a radio-frequency radiation detector, and/or another devicethat measures a physical effect or that characterizes an environmentalfactor or physical phenomenon (either directly or indirectly). Note thatthe one or more sensor devices 626 may include redundancy (such asmultiple instances of a type of sensor device) to address sensor failureor erroneous readings, to provide improved accuracy and/or to provideimproved precision.

Additionally, user-interface subsystem 638 may include one or moreuser-interface devices 640 (such as a touchpad, a knob, a multi-touchscreen, a keyboard, a mouse, a stylus, etc.) and thermal mechanism 642for establishing a temperature gradient on a given one of the one ormore user-interface devices 640 in response to tactile interaction witha user of electronic device 100. In addition, user-interface subsystem638 may include user-interface controllers (or input-output controllers)for the one or more user-interface devices 640, which convert betweenelectrical signals to or from the one or more user-interface devices640, and values used by electronic device 100 (such as setting 108 inFIGS. 2-4).

During operation of electronic device 100, processing subsystem 610 mayexecute one or more program modules 632, such as anenvironmental-monitoring application that uses one or more sensordevices 626 to measure environmental signals associated with an externalenvironment that includes electronic device 100. The resultingmeasurements may be analyzed by the environmental-monitoring applicationto identify or determine an environmental condition associated with theexternal environment. Moreover, the environmental condition may be usedby the environmental-monitoring application to modify operation ofelectronic device and/or the external electronic device (such as aregulator device), and/or to provide information about the externalenvironment to another (separate) electronic device (e.g., vianetworking subsystem 614).

Furthermore, processing subsystem 610 may execute a user-interfaceapplication that receives a setting from a user of electronic devicebased on the user's tactile interaction with a given one of the one ormore user-interface devices 640. Then, user-interface application mayinstruct or may provide a control signal to thermal mechanism 642 tomodify a temperature gradient on a surface of the gibe one ofuser-interface devices 640 to provide intuitive thermal feedback (and,more generally, sensory feedback) to the user about the setting. In someembodiments, user-interface application modifies a function ofelectronic device 100 based on the received setting. For example,user-interface application may instruct or may provide a control signalto change a state of switch 622 (from open to closed or vice versa),thereby changing electrical coupling of a regulator device to one ofpower sources 618. In this way, electronic device 100 may respond to thereceived setting so that an environmental condition (such as thetemperature, humidity, a lighting condition, an allergen level, etc.) inthe external environment can be dynamically modified.

Within electronic device 100, processing subsystem 610, memory subsystem612, networking subsystem 614, power subsystem 616, switching subsystem620, optional sensor subsystem 624 and/or user-interface device 638 maybe coupled using one or more interconnects, such as bus 636. Theseinterconnects may include an electrical, optical, and/or electro-opticalconnection that the subsystems can use to communicate commands and dataamong one another. Note that different embodiments can include adifferent number or configuration of electrical, optical, and/orelectro-optical connections among the subsystems.

Electronic device 100 can be (or can be included in) a wide variety ofelectronic devices. For example, electronic device 100 can be (or can beincluded in): a sensor (such as a smart sensor), a tablet computer, asmartphone, a cellular telephone, an appliance, a regulator device, aconsumer-electronic device (such as a baby monitor), a portablecomputing device, test equipment, a digital signal processor, acontroller, a personal digital assistant, a laser printer (or otheroffice equipment such as a photocopier), a personal organizer, a toy, aset-top box, a computing device (such as a laptop computer, a desktopcomputer, a server, and/or a subnotebook/netbook), a light (such as anightlight), an alarm, a smoke detector, a carbon-monoxide detector, amonitoring device, and/or another electronic device (such as a switch ora router).

Although specific components are used to describe electronic device 100,in alternative embodiments, different components and/or subsystems maybe present in electronic device 100. For example, electronic device 100may include one or more additional processing subsystems, memorysubsystems, networking subsystems, power subsystems, switchingsubsystems, sensor subsystems and/or user-interface subsystems.Additionally, one or more of the subsystems may not be present inelectronic device 100. Moreover, in some embodiments, electronic device100 may include one or more additional subsystems that are not shown inFIG. 6, such as a display subsystem, and/or a feedback subsystem (whichmay include speakers and/or an optical source).

Although separate subsystems are shown in FIG. 6, in some embodiments,some or all of a given subsystem or component can be integrated into oneor more of the other subsystems or components in electronic device 100.For example, in some embodiments the one or more program modules 632 areincluded in operating system 634. In some embodiments, a component in agiven subsystem is included in a different subsystem.

Moreover, the circuits and components in electronic device 100 may beimplemented using any combination of analog and/or digital circuitry,including: bipolar, PMOS and/or NMOS gates or transistors. Furthermore,signals in these embodiments may include digital signals that haveapproximately discrete values and/or analog signals that have continuousvalues. Additionally, components and circuits may be single-ended ordifferential, and power supplies may be unipolar or bipolar.

An integrated circuit may implement some or all of the functionality ofnetworking subsystem 614 (such as a radio) and, more generally, some orall of the functionality of electronic device 100. Moreover, theintegrated circuit may include hardware and/or software mechanisms thatare used for transmitting wireless signals from electronic device 100to, and receiving signals at electronic device 100 from other electronicdevices. Aside from the mechanisms herein described, radios aregenerally known in the art and hence are not described in detail. Ingeneral, networking subsystem 614 and/or the integrated circuit caninclude any number of radios. Note that the radios in multiple-radioembodiments function in a similar way to the radios described insingle-radio embodiments.

In some embodiments, networking subsystem 614 and/or the integratedcircuit include a configuration mechanism (such as one or more hardwareand/or software mechanisms) that configures the radio(s) to transmitand/or receive on a given communication channel (e.g., a given carrierfrequency). For example, in some embodiments, the configurationmechanism can be used to switch the radio from monitoring and/ortransmitting on a given communication channel to monitoring and/ortransmitting on a different communication channel. (Note that‘monitoring’ as used herein comprises receiving signals from otherelectronic devices and possibly performing one or more processingoperations on the received signals, e.g., determining if the receivedsignal comprises an advertising frame, a petition, a beacon, etc.)

While some of the operations in the preceding embodiments wereimplemented in hardware or software, in general the operations in thepreceding embodiments can be implemented in a wide variety ofconfigurations and architectures. Therefore, some or all of theoperations in the preceding embodiments may be performed in hardware, insoftware or both.

Note that aspects of the user-interface technique may be implementedusing an integrated circuit (such as a user-interface controller). Insome embodiments, an output of a process for designing an integratedcircuit, or a portion of an integrated circuit, which includes one ormore of the circuits described herein may be a computer-readable mediumsuch as, for example, a magnetic tape or an optical or magnetic disk.The computer-readable medium may be encoded with data structures orother information describing circuitry that may be physicallyinstantiated as the integrated circuit or the portion of the integratedcircuit. Although various formats may be used for such encoding, thesedata structures are commonly written in: Caltech Intermediate Format(CIF), Calma GDS II Stream Format (GDSII) or Electronic DesignInterchange Format (EDIF). Those of skill in the art of integratedcircuit design can develop such data structures from schematic diagramsof the type detailed above and the corresponding descriptions and encodethe data structures on the computer-readable medium. Those of skill inthe art of integrated circuit fabrication can use such encoded data tofabricate integrated circuits that include one or more of the circuitsdescribed herein.

We now further describe the user-interface technique and operation ofthe electronic device. FIG. 7 presents a flow diagram illustrating amethod 700 for interacting with a user, which may be performed byelectronic device 100 (FIGS. 1 and 6). During operation, the electronicdevice receives a setting (operation 710) based on tactile interactionbetween the user and a surface of a user-interface device in theelectronic device. Then, a thermal mechanism in the electronic deviceestablishes a temperature gradient (operation 712) on the surface basedon the setting.

FIG. 8 presents a drawing illustrating communication within electronicdevice 100 during method 700 (FIG. 7). During operation of electronicdevice 100, a user adjusts user-interface device 110 to change a setting810. In response to receiving setting 810, processor 812 providescontrol signal 814 to thermal mechanism 210, which changes a temperaturegradient 816 on a surface of user-interface device 110. In someembodiments, processor 812 optionally changes a function 818 ofelectronic device 100 in response to setting 810.

While some of the preceding embodiments illustrated user-interfacedevice and thermal mechanism performing operations in the user-interfacetechnique, in other embodiments at least some of these operations areperformed by a processor in electronic device 100 (i.e., at least someof the operations may be performed by software executed by theprocessor). Furthermore, while the preceding embodiments illustratedelectronic and geometric techniques for changing the temperaturegradient and/or the user's perception of the temperature gradient, inother embodiments mechanical techniques may be used to achieve either orboth of these effects. For example, a mechanical actuator may increasean angle or tilt of the user-interface device so that the user perceivesa different temperature gradient over the surface of the user-interfacedevice.

In some embodiments of one or more of the preceding methods, there maybe additional or fewer operations. Furthermore, the order of theoperations may be changed, and/or two or more operations may be combinedinto a single operation. In addition, in some of the precedingembodiments there are fewer components, more components, a position of acomponent is changed and/or two or more components are combined.

In the preceding description, we refer to ‘some embodiments.’ Note that‘some embodiments’ describes a subset of all of the possibleembodiments, but does not always specify the same subset of embodiments.

The foregoing description is intended to enable any person skilled inthe art to make and use the disclosure, and is provided in the contextof a particular application and its requirements. Moreover, theforegoing descriptions of embodiments of the present disclosure havebeen presented for purposes of illustration and description only. Theyare not intended to be exhaustive or to limit the present disclosure tothe forms disclosed. Accordingly, many modifications and variations willbe apparent to practitioners skilled in the art, and the generalprinciples defined herein may be applied to other embodiments andapplications without departing from the spirit and scope of the presentdisclosure. Additionally, the discussion of the preceding embodiments isnot intended to limit the present disclosure. Thus, the presentdisclosure is not intended to be limited to the embodiments shown, butis to be accorded the widest scope consistent with the principles andfeatures disclosed herein.

What is claimed is:
 1. An electronic device, comprising: auser-interface device having a surface that, during operation, receivesa user selectable temperature setting to alter temperature of atemperature controlled environment based on tactile interaction with auser of the electronic device; and a thermal mechanism, thermallycoupled to a portion of the user-interface device, which, duringoperation, establishes a single temperature gradient on the surfacebased on the temperature setting and a temperature of the temperaturecontrolled environment that includes the electronic device, wherein,during operation, the thermal mechanism dynamically modifies thetemperature gradient so that, as the temperature setting is adjusted bythe user to exceed and then progressively increase relative to thetemperature of the temperature controlled environment, the thermalmechanism increases the temperature gradient, and, as the temperaturesetting is adjusted by the user to drop below and then progressivelydecrease relative to the temperature of the temperature controlledenvironment, the thermal mechanism decreases the temperature gradient,as user temperature setting input feedback.
 2. The electronic device ofclaim 1, wherein the thermal mechanism includes a heat source that,during operation, increases a temperature of the portion of theuser-interface device.
 3. The electronic device of claim 2, wherein thethermal mechanism includes a heat sink that, during operation, decreasesa temperature of another portion of the user-interface device, which isdifferent that the portion of the user-interface device.
 4. Theelectronic device of claim 1, wherein the thermal mechanism includes aheat sink that, during operation, decreases a temperature of the portionof the user-interface device.
 5. The electronic device of claim 1,wherein the user-interface device has a thermal time constant thatallows the temperature gradient to be established while the userinteracts with the user-interface device.
 6. The electronic device ofclaim 1, wherein the tactile interaction includes changing thetemperature setting of the electronic device using the user-interfacedevice.
 7. The electronic device of claim 1, wherein the user-interfacedevice includes one of: a touch pad, a multi-touch display, and a knob.8. The electronic device of claim 1, wherein the electronic deviceincludes a thermostat.
 9. The electronic device of claim 1, wherein athermal impedance of the user-interface device varies over theuser-interface device to increase user perception of the temperaturegradient.
 10. The electronic device of claim 9, wherein the variation inthe thermal impedance is associated with different thicknesses of amaterial in at least one layer in the user-interface device.
 11. Theelectronic device of claim 1, wherein a texture varies over the surfaceof the user-interface device to increase user perception of thetemperature gradient.
 12. The electronic device of claim 1, wherein across-sectional area of the portion of the user-interface device variesas the user changes the temperature setting using the user-interfacedevice; and wherein the varying cross-sectional area changes a thermalimpedance of the portion of the user-interface device to increase userperception of the temperature gradient.
 13. The electronic device ofclaim 1, wherein, at a given time, the thermal mechanism provides astatic thermal flux.
 14. The electronic device of claim 1, wherein, at agiven time during operation, the thermal mechanism establishes thetemperature gradient by duty-cycle averaging thermal pulses.
 15. Theelectronic device of claim 1, wherein, during operation, theuser-interface device can be rotated about an axis; and wherein arotational resistance of the user-interface device varies as the userrotates the user-interface device between end rotation positionsassociated with extrema of temperature settings defined using theuser-interface device.
 16. The electronic device of claim 15, whereinthe rotational resistance varies continuously as the user-interfacedevice is rotated between the end rotation positions.
 17. The electronicdevice of claim 15, wherein the rotational resistance varies when theuser-interface device is rotated in proximity to the end rotationpositions.
 18. The electronic device of claim 15, wherein the rotationresistance is associated with one or more of: an electromagnet, aferro-magnet, a phase change of a material, a magnetorheological fluid,and a mechanical stop.
 19. An electronic device, comprising: auser-interface device having a surface that, during operation, receivesa user selectable temperature setting to alter temperature of atemperature controlled environment based on tactile interaction with auser of the electronic device; a thermal mechanism, thermally coupled toa portion of the user-interface device, which, during operation,establishes a single temperature gradient on the surface based on thetemperature setting and a temperature of the temperature controlledenvironment that includes the electronic device, wherein, duringoperation, the thermal mechanism dynamically modifies the temperaturegradient so that, as the temperature setting is adjusted by the user toexceed and then progressively increase relative to the temperature ofthe temperature controlled environment, the thermal mechanism increasesthe temperature gradient, and, as the temperature setting is adjusted bythe user to drop below and then progressively decrease relative to thetemperature of the temperature controlled environment, the thermalmechanism decreases the temperature gradient, as user temperaturesetting input feedback; and a control circuit, electrically coupled tothe user-interface device, which, during operation, modifies a functionof the electronic device to alter temperature of the temperaturecontrolled environment based on the received temperature setting.
 20. Anelectronic-device-implemented method for interacting with a user,wherein the method comprises: receiving a user selectable temperaturesetting to alter temperature of a temperature controlled environmentbased on tactile interaction between the user and a surface of auser-interface device in the electronic device; and using a thermalmechanism in the electronic device to establish a single temperaturegradient on the surface based on the temperature setting and atemperature of the temperature controlled environment that includes theelectronic device, wherein the thermal mechanism dynamically modifiesthe temperature gradient so that, as the temperature setting is adjustedby the user to exceed and then progressively increase relative to thetemperature of the temperature controlled environment, the thermalmechanism increases the temperature gradient, and, as the temperaturesetting is adjusted by the user to drop below and then progressivelydecrease relative to the temperature of the temperature controlledenvironment, the thermal mechanism decreases the temperature gradient,as user temperature setting input feedback; and wherein the thermalmechanism includes at least one of: a heat source, and a heat sink.